To bring the best performance and safety factors to their customers Reimers Electra Steam performs additional testing beyond UL requirements. In the pictured panel box and element mounting area thermocouples are being mounted to confirm temperature rise during peak output. It has proven that in semiconductor and electronic parts, failure rate hugely increases and life shortens as heat increases.
Higher operating temperatures decrease the service life of any device or module. Any temperature sensitive materials used in a module can degrade and wear out more quickly. Other failure mechanisms, such as metal migration, can occur, particularly when both high temperature and humidity conditions are present. Here, metal whiskers or dendrites can grow from the conducting lines. With lines being spaced closer together in today’s devices, shorts between lines can occur and cause device failure. Additionally, when temperatures fluctuate, device interconnections and other components can fatigue from expansion and contraction due to thermal stresses and eventually fail.
Higher temperatures also increase the electrical resistance of the conducting lines within a device or module, slowing the signal speed and reducing performance. As devices become more complex, conducting paths become longer and this performance reduction is more significant. For all of the above reasons, it’s critical to minimize temperature of the electronics by designing efficient ways of carrying away their generated heat. This is just one design enhancement Reimers brings to their customers.